5G high-speed interconnect design

Written by: COMSOL | Published: 12/17

Date: 7th December, Time: 7:00PM GMT

If you want to learn about designing high-speed interconnects for 5G and Satcom applications, tune into this webinar with guest speaker Eric Gebhard of Signal Microwave.

Connector implementation is often the last part of a design that an engineer thinks of when developing and testing new digital and RF products for 5G and Satcom applications, yet it can greatly affect the performance of a design.

One of the keys to avoiding this issue is to properly design the interface between the printed circuit board and the connector, known as the board launch. Connectors and how they interact with the board launch can determine the success or failure of a design. If the signal entering or leaving the board launch through the connector is compromised, then the performance of the entire design is affected.

In this webinar, you will see a live demonstration in the COMSOL Multiphysics software of how to set up and run a simulation to evaluate and optimise the performance of a board launch. You can ask questions at the end of the webinar during the Q&A session.

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